With the continuous improvement of China's electronic technology, China has become a processing plant in the world's electronics industry. Surface Mount Technology (SMT) is an important part of advanced electronic manufacturing technology. As a national high-tech enterprise, Jarol shares' main products cover industrial automation products serving various fields. The production of products involves SMT patch parts, which were previously outsourced.
In order to meet the company's production needs, further control the product quality, and improve the product's competitiveness in the international and domestic markets, Jarol shares has introduced an SMT patch processing factory, mainly engaged in inverters, servo systems, engineering cabinets, inverter cabinets and other industries Automated product motherboard production and circuit board production escort the company's development!
The automatic SMT plant has two production lines. The SMT production equipment is high-precision mechatronics equipment. The workshop is a 100,000-level dust-free cleanliness, anti-static, constant temperature and humidity workshop to ensure the normal operation of the equipment And assembly quality.
The SMT production process flow mainly includes several important processes such as solder paste printing, 3D-SPI solder paste thickness detection, part placement, reflow soldering, AOI optical inspection, and plug-in. The strict and precise execution of each process is the prerequisite for ensuring product quality.
Solder paste printing: Appropriate amount of solder paste is evenly applied on the PCB pads to ensure that the corresponding solder pads of the chip components and the PCB are reflow soldered to achieve good electrical connection and have sufficient mechanical strength.
3D-SPI solder paste thickness detection: 3D SPI solder paste inspection equipment can find defective products before parts are mounted, which can reduce waste generation. The production cost savings after the introduction of SPI, the sooner the defect is found, the less the maintenance cost.
Part placement: Use the placement machine to accurately place the chip components on the PCB surface where the solder paste or patch glue is printed.
Reflow soldering: By melting the solder paste on the circuit board pads, the mechanical and electrical connection between the soldering ends of the surface-mounted components and the PCB pads is realized to form an electrical circuit.
AOI optical inspection: Welding quality and assembly quality inspection of the assembled PCB board. The equipment used is automatic optical inspection (AOI), which detects defective PCBs, improves the quality of PCBs, and reduces scrap.
Plug-in: Insert the processed components into the corresponding position on the PCB.
Furnace curing: Melting the patch glue, so that the surface assembled components and the PCB board are firmly bonded together.
Assembly and packaging: according to the standard operation of the assembly line by different inspectors, after passing the package to the packaging area.
The introduction of the SMT patch processing plant has injected new vitality into the company's development, greatly improved the production efficiency of the product, and also fully guaranteed the quality and output of the product, allowing customers to buy more at ease and peace of mind, but also to make Jarol shares’ development has reached a new level.